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1

Problems of PCB microvias filling by conductive paste

Ryszard Kisiel, Jan Felba, Janusz Borecki, Andrzej Moscicki

Journal:

Microelectronics Reliability

Year:

2007

Language:

english

File:

PDF, 586 KB

english, 2007

2

[IEEE 2019 42nd International Spring Seminar on Electronics Technology (ISSE) - Wroclaw, Poland (2019.5.15-2019.5.19)] 2019 42nd International Spring Seminar on Electronics Technology (ISSE) - Defects Investigation in Low-Temperature and Low-Pressure Sintered Silver Thermal Joints for Non-Metalized Semiconductors

Stojek, Krzysztof, Felba, Jan, Lizanets, Danylo, Kiliszkiewicz, Milena, Falat, Tomasz, Gorzka, Kamil

Year:

2019

Language:

english

File:

PDF, 1.74 MB

english, 2019

3

Conductive adhesives for through holes and blind vias metallization

Ryszard Kisiel, Janusz Borecki, Grażyna Kozioł, Jan Felba

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 239 KB

english, 2005

4

Ink for Ink-Jet Printing of Electrically Conductive Structures on Flexible Substrates with Low Thermal Resistance

A. Mościcki,A. Smolarek-Nowak,J. Felba,A. Kinart

Journal:

Journal of Electronic Materials

Year:

2017

Language:

english

File:

PDF, 1.39 MB

english, 2017

5

Snap-Curing Electrically Conductive Formulation for Solder Replacement Applications

Mościcki, Andrzej, Felba, Jan, Sobierajski, Tadeusz, Kudzia, Józef

Journal:

Journal of Electronic Packaging

Year:

2005

Language:

english

File:

PDF, 417 KB

english, 2005

6

Polytronic 2005

Andrzej Dziedzic, Jan Felba

Journal:

Microelectronics Reliability

Year:

2007

Language:

english

File:

PDF, 70 KB

english, 2007

7

[IEEE 2010 3rd Electronic System-Integration Technology Conference (ESTC) - Berlin, Germany (2010.09.13-2010.09.16)] 3rd Electronics System Integration Technology Conference ESTC - Influence of nano silver filler content on properties of ink-jet printed structures for microelectronics

Falat, Tomasz, Felba, Jan, Moscicki, Andrzej, Smolarek, Anita, Bock, Karlheinz, Bonfert, Detlef

Year:

2010

Language:

english

File:

PDF, 1.15 MB

english, 2010

8

[IEEE 2011 IEEE 11th International Conference on Nanotechnology (IEEE-NANO) - Portland, OR, USA (2011.08.15-2011.08.18)] 2011 11th IEEE International Conference on Nanotechnology - Electrical, thermal and mechanical properties of epoxy composites with hybrid micro- and nano-sized fillers for electronic packaging

Falat, Tomasz, Felba, Jan, Matkowski, Przemyslaw, Platek, Bartosz, Demont, Philippe, Marcq, Fabien, Monfraix, Philippe, Moscicki, Andrzej, Poltorak, Krzysztof

Year:

2011

Language:

english

File:

PDF, 673 KB

english, 2011

9

[IEEE 2012 4th Electronic System-Integration Technology Conference (ESTC) - Amsterdam, Netherlands (2012.09.17-2012.09.20)] 2012 4th Electronic System-Integration Technology Conference - Photonic sintering process of ink-jet printed conductive microstructures

Falat, Tomasz, Platek, Bartosz, Felba, Jan, Moscicki, Andrzej, Smolarek, Anita, Stojek, Krzysztof

Year:

2012

File:

PDF, 547 KB

2012

10

[IEEE Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics - Warsaw, Poland (23-26 Oct. 2005)] Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics - Magnetron Sputtering Deposition of Copper on Polymers in High Density Interconnection PCB's

Borecki, J., Felba, J., Posadowski, W.

Year:

2005

Language:

english

File:

PDF, 2.54 MB

english, 2005

11

[IEEE 2013 IEEE 13th International Conference on Nanotechnology (IEEE-NANO) - Beijing, China (2013.08.5-2013.08.8)] 2013 13th IEEE International Conference on Nanotechnology (IEEE-NANO 2013) - Nano sized silver for electronic packaging

Felba, J., Falat, T., Moscicki, A.

Year:

2013

Language:

english

File:

PDF, 298 KB

english, 2013

12

[IEEE 2011 IEEE 11th International Conference on Nanotechnology (IEEE-NANO) - Portland, OR, USA (2011.08.15-2011.08.18)] 2011 11th IEEE International Conference on Nanotechnology - The method of carbon nanotube dispersing for composites used in electronic packaging

Platek, Bartosz, Urbanski, Krzysztof, Falat, Tomasz, Felba, Jan

Year:

2011

Language:

english

File:

PDF, 1.32 MB

english, 2011

13

Measurements of beam emittance in electron beam welding

Friedel, K, Felba, J

Journal:

Welding International

Year:

1994

Language:

english

File:

PDF, 540 KB

english, 1994

14

Heat treatment by electron beam

Olszewska-Mateja, B, Felba, J

Journal:

Welding International

Year:

1991

Language:

english

File:

PDF, 1023 KB

english, 1991

15

Application of glow discharge electron gun to surface modification

J. Felba, K. Friedel, K. Przybecki

Journal:

Year:

1990

Language:

english

File:

PDF, 424 KB

english, 1990

16

Low voltage scanning electron microscope with a combined multi-electrode retarding lens and detector

W Słówko, W Drzazga, J Felba

Journal:

Year:

1996

Language:

english

File:

PDF, 419 KB

english, 1996

17

Revealing the defects in electron-irradiated Czochralski silicon

A. Misiuk, J. Bak-Misiuk, W. Jung, J. Felba, W. Wierzchowski, K. Wieteska, M. Prujszczyk

Journal:

Radiation Measurements

Year:

2010

Language:

english

File:

PDF, 596 KB

english, 2010

18

A new generation of power supplies for electron beam welding machines

Jerzy Dora, Jan Felba, Wiktor Sielanko

Journal:

Year:

2005

Language:

english

File:

PDF, 183 KB

english, 2005

19

Electron beam activated brazing of cubic boron nitride to tungsten carbide cutting tools

Jan Felba, Kazimierz P Friedel, Peter Krull, Igor L Pobol, Helmut Wohlfahrt

Journal:

Year:

2001

Language:

english

File:

PDF, 445 KB

english, 2001

20

A systematic method for optimizing the electron beam hardening process

KP Friedel, J Felba, I Pobol, A Wymysłowski

Journal:

Year:

1996

Language:

english

File:

PDF, 720 KB

english, 1996

21

Emittance of high-power-density electron beam

Journal:

Year:

1999

Language:

english

File:

PDF, 311 KB

english, 1999

22

The optimization of a triode electron gun with a thermionic cathode

J. Felba, K.P. Friedel, S. Wójcicki

Journal:

Applied Surface Science

Year:

1997

Language:

english

File:

PDF, 462 KB

english, 1997

23

Model of beam formation in a glow discharge electron gun with a cold cathode

S.V. Denbnovetsky, J. Felba, V.I. Melnik, I.V. Melnik

Journal:

Applied Surface Science

Year:

1997

Language:

english

File:

PDF, 367 KB

english, 1997

24

[IEEE 2012 IEEE 12th International Conference on Nanotechnology (IEEE-NANO) - Birmingham, United Kingdom (2012.08.20-2012.08.23)] 2012 12th IEEE International Conference on Nanotechnology (IEEE-NANO) - Interconnection process by ink jet printing method

Moscicki, Andrzej, Falat, Tomasz, Smolarek, Anita, Kinart, Andrzej, Felba, Jan, Borecki, Janusz

Year:

2012

Language:

english

File:

PDF, 1.64 MB

english, 2012

25

[IEEE 2012 13th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Cascais, Portugal (2012.04.16-2012.04.18)] 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Sintering process of silver nanoparticles in ink-jet printed conductive microstructures - Molecular dynamics approach

Falat, Tomasz, Platek, Bartosz, Felba, Jan

Year:

2012

Language:

english

File:

PDF, 1.71 MB

english, 2012

26

[IEEE Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics - Warsaw, Poland (23-26 Oct. 2005)] Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics - Electrically Conductive Formulations Filled Nano Size Silver Filler for Ink-Jet Technology

Moscicki, A., Felba, J., Sobierajski, T., Kudzia, J., Arp, A., Meyer, W.

Year:

2005

Language:

english

File:

PDF, 3.50 MB

english, 2005

27

[IEEE Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Linz, Austria (2011.04.18-2011.04.20)] 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Non-equilibrium molecular dynamics simulation of heat transfer in carbon nanotubes - verification and model validation

Falat, Tomasz, Platek, Bartosz, Felba, Jan

Year:

2011

Language:

english

File:

PDF, 1.34 MB

english, 2011

28

[IEEE 2008 2nd Electronics Systemintegration Technology Conference - Greenwich (2008.09.1-2008.09.4)] 2008 2nd Electronics Systemintegration Technology Conference - Application of FPGA units in combined temperature cycle and vibration reliability tests of lead-free interconnections

Matkowski, P., Falat, K., Felba, J., Zaluk, Z., Zwierta, R., Dasgupta, A., Pecht, M.

Year:

2008

Language:

english

File:

PDF, 3.71 MB

english, 2008

29

[IEEE Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics - Tokyo, Japan (2007.01.16-2007.01.18)] Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics - Thermally Conductive Adhesives for Microelectronics - Barriers of Heat Transport

Felba, Jan, Faaat, Tomasz

Year:

2007

Language:

english

File:

PDF, 4.70 MB

english, 2007

30

[IEEE Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Linz, Austria (2011.04.18-2011.04.20)] 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - The influence of molecular dynamics simulation parameters on the accuracy of carbon nanotubes thermal conductivity calculations

Platek, Bartosz, Falat, Tomasz, Felba, Jan

Year:

2011

Language:

english

File:

PDF, 1.23 MB

english, 2011

31

[IEEE Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics - Tokyo, Japan (2007.01.16-2007.01.18)] Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics - Conductivity improvement of microstructures made by nano-size-silver filled formulations

Moscicki, Andrzej, Felba, Jan, Gwiazdzinski, Przemyslaw, Puchalski, Michal

Year:

2007

Language:

english

File:

PDF, 5.18 MB

english, 2007

32

[IEEE 2006 1st Electronic Systemintegration Technology Conference - Dresden, Germany (2006.09.5-2006.09.7)] 2006 1st Electronic Systemintegration Technology Conference - Conductive Microstructures and Connections for Microelectronics Made by Ink-Jet Technology

Mooscicki, Andrzej, Felba, Jan, Dudzinski, Wlodzimierz

Year:

2006

Language:

english

File:

PDF, 6.86 MB

english, 2006

33

[IEEE 2010 3rd Electronic System-Integration Technology Conference (ESTC) - Berlin, Germany (2010.09.13-2010.09.16)] 3rd Electronics System Integration Technology Conference ESTC - The impact of carbon nanotubes diameter on their thermal conductivity - Non-equilibrium molecular dynamics approach

Platek, Bartosz, Falat, Tomasz, Felba, Jan

Year:

2010

Language:

english

File:

PDF, 1.34 MB

english, 2010

34

[IEEE 2011 34th International Spring Seminar on Electronics Technology (ISSE) - Tratanska Lomnica, Slovakia (2011.05.11-2011.05.15)] Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) - Dependency of silver nanoparticles protective layers on sintering temperature of printed conductive structures

Smolarek, Anita, Moscicki, Andrzej, Kinart, Andrzej, Felba, Jan, Falat, Tomasz

Year:

2011

Language:

english

File:

PDF, 1.29 MB

english, 2011

35

[IEEE 2014 37th ISSE International Spring Seminar in Electronics Technology (ISSE) - Dresden, Germany (2014.5.7-2014.5.11)] Proceedings of the 2014 37th International Spring Seminar on Electronics Technology - Structure of the Thermal Interface connection made of sintered nano silver

Matkowski, Przemyslaw Krystian, Falat, Tomasz, Zaluk, Zbigniew, Felba, Jan, Moscicki, Andrzej

Year:

2014

Language:

english

File:

PDF, 1.19 MB

english, 2014

36

[IEEE 2008 IEEE Interdisciplinary Conf on Portable Info Devices (PORTABLE) - Polytronic 2008 IEEE Conf on Polymers and Adhesives in Microelectronics and Photonics - Garmisch-Partenkirchen, Germany (2008.08.17-2008.08.20)] PORTABLE-POLYTRONIC 2008 - 2nd IEEE International Interdisciplinary Conference on Portable Information Devices and the 2008 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics - The polymer materials as the essential input parameters in numerical multi-objective optimization of stacked packaging

Dowhan, Lukasz, Wymyslowski, Artur, Felba, Jan, Dudek, Rainer

Year:

2008

Language:

english

File:

PDF, 786 KB

english, 2008

37

[IEEE 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings - Zalaegerszeg, Hungary (23-26 June 2002)] 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599) - The influence of filler particle shapes on adhesive joints in microwave applications

Felba, J., Friedel, K., Guenther, B., Moscicki, A., Schafer, H.

Year:

2002

Language:

english

File:

PDF, 772 KB

english, 2002

38

[IEEE 2006 1st Electronic Systemintegration Technology Conference - Dresden, Germany (2006.09.5-2006.09.7)] 2006 1st Electronic Systemintegration Technology Conference - Viscoelastic Characterization of Polymer Matrix of Thermally Conductive Adhesives

Falat, Tomasz, Felba, Jan, Wymylowski, Artur, Jansen, B., Nakka, John

Year:

2006

Language:

english

File:

PDF, 8.23 MB

english, 2006

39

[IEEE 2011 34th International Spring Seminar on Electronics Technology (ISSE) - Tratanska Lomnica, Slovakia (2011.05.11-2011.05.15)] Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) - Inkjet printed electrically conductive structures for microelectronics

Year:

2011

Language:

english

File:

PDF, 521 KB

english, 2011

40

[IEEE 2011 IEEE 11th International Conference on Nanotechnology (IEEE-NANO) - Portland, OR, USA (2011.08.15-2011.08.18)] 2011 11th IEEE International Conference on Nanotechnology - Nano-silver inkjet printed interconnections through the microvias for flexible electronics

Falat, Tomasz, Felba, Jan, Moscicki, Andrzej, Borecki, Janusz

Year:

2011

Language:

english

File:

PDF, 2.26 MB

english, 2011

41

[IEEE 2014 37th ISSE International Spring Seminar in Electronics Technology (ISSE) - Dresden, Germany (2014.5.7-2014.5.11)] Proceedings of the 2014 37th International Spring Seminar on Electronics Technology - Investigation of electrical properties of contacts made of materials based on sintered nano-Ag particles

Urbanski, Krzysztof Jerzy, Falat, Tomasz, Matkowski, Przemyslaw, Szczerba, Marcin, Felba, Jan, Moscicki, Andrzej

Year:

2014

Language:

english

File:

PDF, 1.08 MB

english, 2014

42

[IEEE 2014 37th ISSE International Spring Seminar in Electronics Technology (ISSE) - Dresden, Germany (2014.5.7-2014.5.11)] Proceedings of the 2014 37th International Spring Seminar on Electronics Technology - Evaluation of the interfacial resistance between carbon nanotube and silicon by using molecular dynamics simulations

Platek, Bartosz, Falat, Tomasz, Felba, Jan

Year:

2014

Language:

english

File:

PDF, 579 KB

english, 2014

43

[IEEE Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics - Warsaw, Poland (23-26 Oct. 2005)] Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics - Problems of PCB Microvias Filling by Conductive Paste

Kisiel, R., Felba, J., Borecki, J., Moscicki, A.

Year:

2005

Language:

english

File:

PDF, 3.50 MB

english, 2005

44

[IEEE Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics - Warsaw, Poland (23-26 Oct. 2005)] Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics - Effects of Printed Circuit Board Materials on Lead-free Interconnect Durability

Haiyu Qi,, Ganesan, S., Ji Wu,, Pecht, M., Matkowski, P., Felba, J.

Year:

2005

Language:

english

File:

PDF, 2.49 MB

english, 2005

45

[IEEE 2009 32nd International Spring Seminar on Electronics Technology (ISSE) - Brno, Czech Republic (2009.05.13-2009.05.17)] 2009 32nd International Spring Seminar on Electronics Technology - An approach to measurement and evaluation of the thermal conductivity of the thermal adhesives in electronic packaging

Falat, Tomasz, Platek, Bartosz, Tesarski, Sebastian, Felba, Jan

Year:

2009

Language:

english

File:

PDF, 1.17 MB

english, 2009

46

[IEEE 2012 35th International Spring Seminar on Electronics Technology (ISSE) - Bad Aussee, Austria (2012.05.9-2012.05.13)] 2012 35th International Spring Seminar on Electronics Technology - The manufacture process influence on thermal conductivity of polymers thermal interface materials with carbon nanotubes

Platek, Bartosz, Falat, Tomasz, Felba, Jan

Year:

2012

Language:

english

File:

PDF, 509 KB

english, 2012

47

[IEEE 2009 32nd International Spring Seminar on Electronics Technology (ISSE) - Brno, Czech Republic (2009.05.13-2009.05.17)] 2009 32nd International Spring Seminar on Electronics Technology - Vibration response of printed circuit board in wide range of temperature. Characterization of PCB materials

Matkowski, Przemyslaw, Zawierta, Rafal, Felba, Jan

Year:

2009

Language:

english

File:

PDF, 2.03 MB

english, 2009

48

[IEEE 2013 IEEE 13th International Conference on Nanotechnology (IEEE-NANO) - Beijing, China (2013.08.5-2013.08.8)] 2013 13th IEEE International Conference on Nanotechnology (IEEE-NANO 2013) - Numerical study on thermal conductivity of nanomaterials - coarse Grained Molecular Dynamics Approach

Falat, T., Platek, B., Zawierta, M., Felba, J.

Year:

2013

Language:

english

File:

PDF, 580 KB

english, 2013

49

[IEEE 2011 34th International Spring Seminar on Electronics Technology (ISSE) - Tratanska Lomnica, Slovakia (2011.05.11-2011.05.15)] Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) - An accurate method for thermal conductivity measurement of thermally conductive adhesives

Platek, Bartosz, Falat, Tomasz, Felba, Jan

Year:

2011

Language:

english

File:

PDF, 1016 KB

english, 2011

50

Advanced Adhesives in Electronics || Thermally conductive adhesives in electronics

Year:

2011

Language:

english

File:

PDF, 1.25 MB

english, 2011

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